NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 60603-7-1 [Withdrawn] references following documents:
Document number | Edition | Title |
---|---|---|
EN 60068-1 | 1994-10 | Environmental testing - Part 1: General and guidance (IEC 60068-1:1988 + Corrigendum 1988 + A1:1992) More |
EN 60352-2 | 1994-10 | Solderless connections - Part 2: Solderless crimped connections - General requirements, test methods and practical guidance (IEC 60352-2:1990) More |
EN 60352-3 | 1994-10 | Solderless connections - Part 3: Solderless accessible insulation displacement connections - General requirements, test methods and practical guidance (IEC 60352-3:1993) More |
EN 60352-4 | 1994-10 | Solderless connections - Part 4: Solderless non-accessible insulation displacement connections - General requirements, test methods and practical guidance (IEC 60352-4:1994) More |
EN 60512-11-7 | 1996-03 | Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 11: Climatic tests - Section 7: Test 11g: Flowing mixed gas corrosion test (IEC 60512-11-7:1996) More |
EN 60603-1 | 1998-02 | Connectors for frequencies below 3 MHz for use with printed boards - Part 1: Generic specification - General requirements and guide for the preparation of detail specifications, with assessed quality (IEC 60603-1:1991 + A1:1992) More |
HD 625.1 S1 | 1996-09 | Insulation coordination for equipment within low-voltage systems - Part 1: Principles, requirements and tests (IEC 60664-1:1992, modified) More |
IEC 60512-6 | 1984 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 6 : Climatic tests and soldering tests More |
IEC 60603-1 ; QC 010000:1991-06 | 1991-06 | Connectors for frequencies below 3 MHz for use with printed boards; part 1: generic specification; general requirements and guide for the preparation of detail specifications, with assessed quality More |
IEC 60603-1 AMD 1 | 1992-06 | Connectors for frequencies below 3 MHz for use with printed boards; part 1: generic specification; general requirements and guide for the preparation of detail specifications, with assessed quality; amendment 1 More |