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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

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Standards [CURRENT]

EN 61190-1-3
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2002)

Title (German)

Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-3: Anforderungen an Elektroniklote und an Festformlote mit oder ohne Flussmittel für das Löten von Elektronikprodukten (IEC 61190-1-3:2002)

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen

Edition 2002-06

Original language English

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Table of contents

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Daniel Failer

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Terminology

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

EN 61190-1-3 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2002)

Responsible national committee

Daniel Failer

EN 61190-1-3
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2002)