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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

About DKE Projects Drafts Publications Documents withdrawn without replacement National committees European committees International committees

Standards [CURRENT]

EN 60191-6-5
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001)

Title (German)

Mechanische Normung von Halbleiterbauelementen - Teil 6-5: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen; Konstruktionsleitfaden für Feinraster-Ball-Grid-Arrays (FBGA) (IEC 60191-6-5:2001)

Responsible national committee

DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente

Edition 2001-10

Original language English

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Table of contents

Contact

Dr.

Konstantin Petridis

Merianstr. 28
63069 Offenbach am Main

Tel.: +49 69 6308-443

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Terminology

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

EN 60191-6-5 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001)

Responsible national committee

Konstantin Petridis

EN 60191-6-5
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001)