We use cookies to make our website more user-friendly and to continually improve it. Please agree to the use of cookies in order to proceed with using our websites. More information can be found in our data protection information and our cookie guidelines.

- Required
- Functional
- Personalization
- Required
  These cookies are essential for the operation of the site and enable, for example, security-relevant functions. In addition, we can also use this type of cookie to determine whether you want to remain logged in to your profile in order to make our services available to you more quickly when you visit our website again.
- Functional
  In order to further improve our offer and our website, we collect anonymized data for statistics and analysis. With the help of these cookies we can, for example, determine the number of visitors and the effect of certain pages on our website and optimize our content.
- Personalization
  We use these cookies to make it easier for you to use the site. For example, based on a previous (e.g. product search), you can conveniently access it when you visit our website again.

Attention: Your browser doesn't support javascript or you have deactivated Javascript in your browser. Please enable Javascript in your browser in order to be able to use all functions of this website.

NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

About DKE Projects Drafts Publications Documents withdrawn without replacement National committees European committees International committees

Standards [CURRENT]

IEC 60191-6-5
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA)

Title (German)

Mechanische Normung von Halbleiterbauelementen - Teil 6-5: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen; Konstruktionsleitfaden für Feinraster-Ball-Grid-Arrays (FBGA)

Edition 2001-08

Original language English

Price On Request

Order from DIN Media

Table of contents

Economic benefits

DIN SPEC

Why do standards cost money?

Get involved in standardization

Terminology

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

IEC 60191-6-5 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA)

IEC 60191-6-5
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA)