NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

Standards [CURRENT]

DIN EN 60191-6-3
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000); German version EN 60191-6-3:2000

Title (German)

Mechanische Normung von Halbleiterbauelementen - Teil 6-3: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen; Messverfahren für QFP-Gehäusemaße (IEC 60191-6-3:2000); Deutsche Fassung EN 60191-6-3:2000

Document: references other documents

Document: referenced in other documents

Responsible national committee

DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente  

Responsible international committee

IEC/SC 47D - Mechanical standardization for semiconductor devices  

Edition 2001-06
Original language German
Price from 63.80 €
Table of contents

Contact

Dr.

Konstantin Petridis

Merianstr. 28
63069 Offenbach am Main

Tel.: +49 69 6308-443

Send message to contact