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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

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Standards [CURRENT]

EN 60191-6-3
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quad flat packs (QFP) (IEC 60191-6-3:2000)

Title (German)

Mechanische Normung von Halbleiterbauelementen - Teil 6-3: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen; Messverfahren für QFP-Gehäusemaße (IEC 60191-6-3:2000)

Responsible national committee

DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente  

Edition 2000-12
Original language English
Price On Request
Order from DIN Media
Table of contents

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