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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 63203-401-1 ; VDE 0750-33-1:2024-07 [New] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 62899-202-4 | 2021-10 | Printed electronics - Part 202-4: Materials - Conductive ink - Measurement methods for properties of stretchable printed layers (conductive and insulating) More |
| ISO 291 | 2008-05 | Plastics - Standard atmospheres for conditioning and testing More |
| ISO/TS 12901-2 | 2014-01 | Nanotechnologies - Occupational risk management applied to engineered nanomaterials - Part 2: Use of the control banding approach More |
| ASTM D 2653 | 2007 | Standard Test Method for Tensile Properties of Elastomeric Yarns (CRE Type Tensile Testing Machines) More |
| DIN EN IEC 63203-101-1 ; VDE 0750-30-1:2022-12 | 2022-12 | Wearable electronic devices and technologies - Part 101-1: Terminology (IEC 63203-101-1:2021); German version EN IEC 63203-101-1:2021 More |
| DIN EN ISO 291 | 2008-08 | Plastics - Standard atmospheres for conditioning and testing (ISO 291:2008); German version EN ISO 291:2008 More |
| DIN EN 62047-2 | 2007-02 | Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials (IEC 62047-2:2006); German version EN 62047-2:2006 More |
| DIN EN 62047-22 | 2015-04 | Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 62047-22:2014); German version EN 62047-22:2014 More |
| IEC 62047-2 | 2006-08 | Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials More |
| IEC 62047-22 | 2014-06 | Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates More |
