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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 62149-12 ; VDE 0886-149-12:2024-02 [CURRENT] references following documents:
Document number | Edition | Title |
---|---|---|
IEC 60749-10 | 2022-04 | Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly More |
IEC 60749-11 | 2002-04 | Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method More |
IEC 60749-12 | 2017-12 | Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency More |
IEC 60749-25 | 2003-07 | Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling More |
IEC 60749-26 | 2018-01 | Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) More |
IEC 60749-6 | 2017-03 | Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature More |
IEC 60749-7 | 2011-06 | Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases More |
IEC 60825-1 | 2014-05 | Safety of laser products - Part 1: Equipment classification and requirements More |
IEC 60950-1 | 2005-12 | Information technology equipment - Safety - Part 1: General requirements More |
IEC 61300-2-19 | 2012-11 | Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-19: Tests - Damp heat (steady state) More |