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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 63287-1 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60749-15 | 2020-07 | Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices More |
| IEC 60749-20 | 2020-08 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat More |
| IEC 60749-21 | 2011-04 | Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability More |
| IEC 60749-23 | 2004-02 | Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life More |
| IEC 60749-25 | 2003-07 | Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling More |
| IEC 60749-26 | 2018-01 | Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) More |
| IEC 60749-28 | 2022-03 | Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level More |
| IEC 60749-29 | 2011-04 | Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test More |
| IEC 60749-42 | 2014-08 | Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage More |
| IEC 60749-5 | 2017-04 | Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test More |
