NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 60249-2-4 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| EN 60249-1 | 1993-08 | Base materials for printed circuits; part 1: test methods (IEC 60249-1:1982 + A1:1984 + A2:1989 + A3:1991) More |
| DIN EN 61249-5-1 | 1996-06 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings; section 1: Copper foils (for the manufacturer of copper-clad base materials) (IEC 61249-5-1:1995); German version EN 61249-5-1:1996 More |
| EN 60249-1/A4 | 1994-01 | Base materials for printed circuits; part 1: test methods (IEC 60249-1:1982/A4:1993); amendment 4 More |
| EN 61249-5-1 | 1996-01 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacturer of copper-clad base materials) (IEC 61249-5-1:1995) More |
| IEC 61249-5-1 | 1995-11 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials) More |
