NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 62435-7 ; VDE 0884-135-7:2022-10 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60721-3-1 | 2018-02 | Classification of environmental conditions - Part 3-1: Classification of groups of environmental parameters and their severities - Storage More |
| IEC 60749-20 | 2020-08 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat More |
| IEC 60749-20-1 | 2019-06 | Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat More |
| IEC 62435-2 | 2017-01 | Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms More |
| IEC 62435-3 | 2020-02 | Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data More |
| IEC 62435-4 | 2018-06 | Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage More |
| IEC 62435-5 | 2017-01 | Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices More |
| DIN EN IEC 60721-3-1 ; VDE 0468-721-3-1:2018-12 | 2018-12 | Classification of environmental conditions - Part 3-1: Classification of groups of environmental parameters and their severities - Storage (IEC 60721-3-1:2018); German version EN IEC 60721-3-1:2018 More |
| DIN EN IEC 62435-4 ; VDE 0884-135-4:2019-05 | 2019-05 | Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage (IEC 62435-4:2018); German version EN IEC 62435-4:2018 More |
| DIN EN 60749-20-1 | 2009-10 | Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 60749-20-1:2009); German version EN 60749-20-1:2009 More |
