NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 61760-2 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60721-3-1 | 2018-02 | Classification of environmental conditions - Part 3-1: Classification of groups of environmental parameters and their severities - Storage More |
| IEC 60721-3-2 | 2018-02 | Classification of environmental conditions - Part 3-2: Classification of groups of environmental parameters and their severities - Transportation and handling More |
| IEC 60286-4 | 2013-07 | Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms More |
| IEC 60286-5 | 2018-04 | Packaging of components for automatic handling - Part 5: Matrix trays More |
| IEC 60286-6 | 2004-02 | Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components More |
| IEC 60749-1 | 2002-08 | Semiconductor devices - Mechanical and climatic test methods - Part 1: General More |
| IEC 60749-1 Corrigendum 1 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 1: General More |
| IEC 60749-10 | 2022-04 | Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly More |
| IEC 60749-11 | 2002-04 | Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method More |
| IEC 60749-11 Corrigendum 1 | 2003-01 | Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method More |
