NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61249-8-8 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| DIN EN 62326-4-1 | 1997-08 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections; sectional specification; section 1: Capability detail specification; performance levels A, B and C (IEC 62326-4-1:1996); German version EN 62326-4-1:1997 More |
| EN 61189-1 | 1997-04 | Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology (IEC 61189-1:1997) More |
| EN 61189-2 | 1997-04 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (IEC 61189-2:1997) More |
| EN 61189-3 | 1997-04 | Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) (IEC 61189-3:1997) More |
| EN 62326-4-1 | 1997-01 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C (IEC 62326-4-1:1996) More |
| IEC 61189-1 | 1997-03 | Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology More |
| IEC 62326-4-1 ; QC 230401:1996-12 | 1996-12 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C More |
