NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

DIN EN 61189-2 [Withdrawn] referenced in following documents:

Document number Edition Title
DIN EN 61188-1-1 1998-03 Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements; flatness considerations for electronic assemblies (IEC 61188-1-1:1997); German version EN 61188-1-1:1997 More 
DIN EN 61249-2-12 1999-11 Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad; epoxide non-woven aramid laminate of defined flammability, copper-clad (IEC 61249-2-12:1999); German version EN 61249-2-12:1999 More 
DIN EN 61249-2-13 1999-11 Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad; cyanate ester non-woven aramid laminate of defined flammability, copper clad (IEC 61249-2-13:1999); German version EN 61249-2-13:1999 More 
DIN EN 61249-3-3 1999-11 Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards); adhesive coated flexible polyester film (IEC 61249-3-3:1999); German version EN 61249-3-3:1999 More 
DIN EN 61249-3-4 1999-11 Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards); adhesive coated flexible polyimide film (IEC 61249-3-4:1999); German version EN 61249-3-4:1999 More 
DIN EN 61249-3-5 1999-11 Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards); transfer adhesive films (IEC 61249-3-5:1999); German version EN 61249-3-5:1999 More 
DIN EN 61249-8-8 1998-01 Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings; Section 8: Temporary polymer coatings (IEC 61249-8-8:1997); German version EN 61249-8-8:1997 More