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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 62435-4 ; VDE 0884-135-4:2019-05 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC/TR 61340-5-2 | 2018-03 | Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide More |
| IEC/TR 62258-3 | 2010-08 | Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage More |
| IPC JEDEC J-STD-033D | 2018-03-01 | Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices More |
| DIN EN 60068-2-17 | 1995-05 | Environmental testing - Part 2: Tests - Test Q: Sealing (IEC 60068-2-17:1994); German version EN 60068-2-17:1994 More |
| DIN EN 60749-20-1 | 2009-10 | Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 60749-20-1:2009); German version EN 60749-20-1:2009 More |
| DIN EN 61340-5-1 ; VDE 0300-5-1:2017-07 | 2017-07 | Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements (IEC 61340-5-1:2016); German version EN 61340-5-1:2016 More |
| DIN EN 62258-1 ; VDE 0884-101:2011-04 | 2011-04 | Semiconductor die products - Part 1: Procurement and use (IEC 62258-1:2009); German version EN 62258-1:2010 More |
| DIN EN 62258-2 | 2011-12 | Semiconductor die products - Part 2: Exchange data formats (IEC 62258-2:2011); English version EN 62258-2:2011 More |
| DIN EN 62258-5 | 2007-02 | Semiconductor die products - Part 5: Requirements for information concerning electrical simulation (IEC 62258-5:2006); German version EN 62258-5:2006 More |
| DIN EN 62258-6 | 2007-02 | Semiconductor die products - Part 6: Requirements for information concerning thermal simulation (IEC 62258-6:2006); German version EN 62258-6:2006 More |
