NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62326-4 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| DIN EN 61249-5-1 | 1996-06 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings; section 1: Copper foils (for the manufacturer of copper-clad base materials) (IEC 61249-5-1:1995); German version EN 61249-5-1:1996 More |
| DIN EN 62326-4-1 | 1997-08 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections; sectional specification; section 1: Capability detail specification; performance levels A, B and C (IEC 62326-4-1:1996); German version EN 62326-4-1:1997 More |
| EN 61249-5-1 | 1996-01 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacturer of copper-clad base materials) (IEC 61249-5-1:1995) More |
| EN 62326-1 | 1997-01 | Printed boards - Part 1: Generic specification (IEC 62326-1:1996) More |
| EN 62326-4-1 | 1997-01 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C (IEC 62326-4-1:1996) More |
| IEC 61249-5-1 | 1995-11 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials) More |
| IEC 62326-4-1 ; QC 230401:1996-12 | 1996-12 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C More |
