NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

DIN EN IEC 60191-1 [CURRENT] references following documents:

Document number Edition Title
IEC 60191-2 1966 Mechanical standardization of semiconductor devices. Part 2 : Dimensions More 
IEC 60191-4 2013-10 Mechanical Standardization of Semiconductor Devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages More 
IEC 60191-6-1 2001-10 Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals More 
IEC 60191-6-20 2010-08 Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) More 
IEC 60191-6-21 2010-08 Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) More 
IEC 60191-6-3 2000-09 Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quad flat packs (QFP) More 
ISO 261 1998-12 ISO general purpose metric screw threads - General plan More 
ISO 263 1973-04 ISO inch screw threads; General plan and selection for screws, bolts and nuts; Diameter range 0,06 to 6 in More 
ISO 5459 2011-08 Geometrical product specifications (GPS) - Geometrical tolerancing - Datums and datum systems More