NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 60191-1 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60191-2 | 1966 | Mechanical standardization of semiconductor devices. Part 2 : Dimensions More |
| IEC 60191-4 | 2013-10 | Mechanical Standardization of Semiconductor Devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages More |
| IEC 60191-6-1 | 2001-10 | Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals More |
| IEC 60191-6-20 | 2010-08 | Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) More |
| IEC 60191-6-21 | 2010-08 | Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) More |
| IEC 60191-6-3 | 2000-09 | Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quad flat packs (QFP) More |
| ISO 261 | 1998-12 | ISO general purpose metric screw threads - General plan More |
| ISO 263 | 1973-04 | ISO inch screw threads; General plan and selection for screws, bolts and nuts; Diameter range 0,06 to 6 in More |
