NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61191-3 [CURRENT] references following documents:
Document number | Edition | Title |
---|---|---|
IEC 60068-2-58 | 2015-03 | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) More |
IEC 61188-5-1 | 2002-07 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations; Generic requirements More |
IEC 61188-5-2 | 2003-06 | Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations; Discrete components More |
IEC 61188-5-3 | 2007-10 | Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides More |
IEC 61188-5-4 | 2007-10 | Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides More |
IEC 61188-5-5 | 2007-10 | Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides More |
IEC 61188-5-6 | 2003-01 | Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations; Chip carriers with J-leads on four sides More |
IEC 61188-7 | 2017-04 | Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction More |
IEC 61189-2 | 2006-05 | Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures More |
IEC 61190-1-2 | 2014-02 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly More |