DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 60191-6-13
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (IEC 60191-6-13:2016); German version EN 60191-6-13:2016
Mechanische Normung von Halbleiterbauelementen - Teil 6-13: Konstruktionsleitfaden für Open-top-Fassungen für Feinraster-Ball-Grid-Array und Feinraster-Land-Grid-Array (FBGA/FLGA) (IEC 60191-6-13:2016); Deutsche Fassung EN 60191-6-13:2016
Overview
For the testing and pre-aging of semiconductor components it is recommended that such components be mounted in prefabricated sockets. This part of DIN EN 60191 contains the design guidelines for open-top sockets for fine pitch ball grid arrays (FBGA) and fine pitch land grid arrays (FLGA). This standard is intended to define the housing drawings and dimensions of open-top sockets for testing and pre-aging of FBGA and FLGA. This document aims to standardize the external dimensions of the sockets for FBGA and FLGA where development is focused, with the need to ensure their compatibility for the expanding SMD industry worldwide due to additional functions and performance of electrical devices. This standard is the revision of the existing standard and contains the following significant changes compared to DIN EN 60191-6-13:2008: a) explanatory notes on the purpose of the standard in the scope added; b) clause numbering in 4.2 revised; c) definition of the connection diameter clarified by a separate Figure 2; d) values of the sockets in Table 3 for housings with length or width from 21,5 mm to 43 mm added; e) editorial revision of the entire standard for better comprehensibility. The responsible committee is DKE/UK 631.4 "Gehäuse für Halbleiterbauelemente" ("Packages for semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.
