DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62779-1
; VDE 0884-79-1:2017-01
Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements (IEC 62779-1:2016); German version EN 62779-1:2016
Halbleiterbauelemente - Halbleiterschnittstelle zur Kommunikation über den menschlichen Körper - Teil 1: Allgemeine Anforderungen (IEC 62779-1:2016); Deutsche Fassung EN 62779-1:2016
Overview
Human body communication (HBC) uses a user's body to transmit data from one device to another, and allows devices to communicate without wires or using wireless technology. As soon as the devices are simply touched by the user, they are connected to each other using touch and play (TAP) function control and an electrical signal containing the data is transmitted through the body. IEC 60748-4 specifies requirements for integrated interface circuits for semiconductor devices. In particular, Chapter III, Clause 7 of the standard applies to interface circuits for a wired or a wireless communication network via a general channel. However, a channel in human body communications (HBC) is the human body, whose channel characteristics such as signal loss and delay profile are different from the general channel, so that Chapter III, Clause 7 cannot be applied to an HBC interface. In the year 2012, IEEE 802.15.6, a body area network (BAN) communication protocol standard was published, which includes a communication protocol for HBC. In order to ensure compatibility of communication between different devices attached to/in the human body or embedded in peripheral equipment, the IEC 62779 series of standards is used, which is adopted into the German body of standards as DIN EN 62779 (VDE 0884-79). This part of DIN EN 62779 (VDE 0884-79) specifies general requirements for a semiconductor interface for human body communication (HBC). It contains general specifications and functional specifications of the interface as well as limit values and the operating conditions. The responsible committee is DKE/K 631 "Halbleiterbauelemente" ("Semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.
