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NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

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Standards [CURRENT]

EN 61189-3/A1
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards); Amendment A1 (IEC 61189-3:1997/A1:1999)

Title (German)

Prüfverfahren für Elektromaterialien, Verbindungsstrukturen und Baugruppen - Teil 3: Prüfverfahren für Verbindungsstrukturen (Leiterplatten); Änderung A1 (IEC 61189-3:1997/A1:1999)

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen

Edition 1999-09

Original language English

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Daniel Failer

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Terminology

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

EN 61189-3/A1 Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards); Amendment A1 (IEC 61189-3:1997/A1:1999)

Responsible national committee

Daniel Failer

EN 61189-3/A1
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards); Amendment A1 (IEC 61189-3:1997/A1:1999)