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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

About DKE Projects Drafts Publications Documents withdrawn without replacement National committees European committees International committees

Standards [CURRENT]

EN 61189-3
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) (IEC 61189-3:1997)

Title (German)

Prüfverfahren für Elektromaterialien, Verbindungsstrukturen und Baugruppen - Teil 3: Prüfverfahren für Verbindungsstrukturen (Leiterplatten) (IEC 61189-3:1997)

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen

Edition 1997-04

Original language English

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Table of contents

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Daniel Failer

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63069 Offenbach am Main

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Economic benefits

DIN SPEC

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Terminology

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

EN 61189-3 Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) (IEC 61189-3:1997)

Responsible national committee

Daniel Failer

EN 61189-3
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) (IEC 61189-3:1997)