DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61189-2-721
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator (IEC 61189-2-721:2015); German version EN 61189-2-721:2015
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 2-721: Prüfverfahren für Materialien für Verbindungsstrukturen - Messung der relativen Permittivität und des Verlustfaktors von kupferkaschiertem Laminat im Mikrowellen-Frequenzbereich unter Verwendung eines Split Post dielektrischen Resonators (IEC 61189-2-721:2015); Deutsche Fassung EN 61189-2-721:2015
Overview
This standard describes a method for determining the relative permittivity and loss tangent of copper clad laminates at microwave frequencies (from 1,1 GHz to 20 GHz) using a split post dielectric resonator (SPDR). This method applies to the measurement of copper clad laminates and dielectric base materials. Figure 2 shows the component diagram of the test system. The frequency range of the vector network analyzer shall be 500 MHz to 20 GHz. The dynamic range of the vector network analyzer shall be more than 60 dB. Figure A.1 shows an SPDR test apparatus with a nominal frequency of 5 GHz. A 3.5 mm female-to-female adapter shall be used to connect the coaxial cable to the SPDR test apparatus. To set the coupling coefficient, the SPDR test apparatus is provided with a coupling loop at each end. The maximum thickness of the specimen for this test apparatus is 2 mm. The responsible committee is DKE/K 682 "Montageverfahren für elektronische Baugruppen" ("Electronics assembly technology") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
