2. Getting involved
3. Standards Committees
4. DKE

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

Overview

This part of the DIN EN 62878 series of standards specifies the test methods of passive and active device embedded substrates. The basic test methods of printed wiring substrate materials and substrates themselves are specified in IEC 61189-3. This document is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components. The IEC 62878 series neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as an M-type business model in IEC 62421. Clause 4 of the document describes the test procedures. The test shall be performed under normal climatic conditions (or simply specified as normal environment). Visual inspection and microsectioning are explained. During the visual inspection, the appearance, surface finish and conductive pattern of the test specimens shall be checked with the naked eye or with a magnifying glass as specified in the individual specification. The test result shall be evaluated "as agreed between user and supplier". The microsection is used to check the condition, appearance and dimensions according to the individual specifications for the plated-through hole, the through-plating in the assembly position, conductor, layer spacing, conductor spacing and connections of the embedded component. The test specimen is embedded in epoxy or polyester resin and a cross section of the test specimen is made and polished for viewing. Evaluation of the results is to be agreed between user and supplier. The test equipment, the material, the test specimen and the test are specified. The clause Electrical Tests deals with the testing of conductor resistance, through-hole and through-plating in the assembly position, current carrying capacity of the connection of an embedded component, dielectric strength in printed circuit boards with embedded components, insulation resistance as well as circuit continuity and circuit insulation. The mechanical tests are used to verify the mechanical strength of the PCB with embedded components according to the PCB specification (CAD/CAM test data and individual specification) for the conductor, the pad of a non-metallized hole, the through-metallized hole, the soldering area of a land pattern, the solder cover and the marking by applying a specified mechanical load. Environmental tests of printed circuit boards with embedded components are used to estimate the lifetime of a product under high and low temperature as well as extreme humidity load. The environmental load is evaluated under the operating conditions of a printed circuit board with embedded components. Part of the mechanical environmental testing is the migration resistance. Migration resistance testing determines the reduction in insulation resistance after a potential is applied between the conductive layers in a printed circuit board in a specific temperature and humidity environment to cause metal ions in a conductive layer to dissolve in order to reduce the insulation resistance. The quality of all products is checked according to this standard during the delivery test. It is recommended that all products be tested. However, random sample test specimens may be tested as agreed between the user and supplier for sampling and test details. The tests to be performed before delivery are specified for PCBs with embedded components. The informative Annex A contains a table of associated test procedures. The bibliography completes the document. The responsible committee is DKE/K 682 "Montageverfahren für elektronische Baugruppen" ("Electronics assembly technology") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.

Document: references other documents

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen