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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

DIN EN 61189-5-3 [CURRENT] references following documents:

Document number Edition Title
IEC 61190-1-2 2014-02 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly More 
IEC 61189-5 2006-08 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies More 
IEC 61189-6 2006-07 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in electronic assemblies More 
ASTM D 1210 2005 Standard Test Method for Fineness of Dispersion of Pigment-Vehicle Systems by Hegman-Type Gage More 
IEC 60068-1 2013-10 Environmental testing - Part 1: General and guidance More 
IEC 61189-1 1997-03 Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology More 
IEC 61189-2 2006-05 Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures More 
IEC 61189-3 2007-10 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) More 
IEC 61190-1-1 2002-03 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly More 
IEC 61249-2-7 2002-03 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad; Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad More