2. Getting involved
3. Standards Committees
4. DKE

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

Overview

This Part 5-3 of the series IEC 61189 describes test methods for materials or component robustness for printed board assemblies, irrespective of their method of manufacture. The standard is divided into separate parts, covering information for the designer and the test methodology engineer or technician. Each part has a specific focus. The methods are grouped according to their application and numbered sequentially as they are developed and released. In some instances test methods developed by other TCs have been reproduced from existing IEC standards in order to provide the reader with a comprehensive set of test methods. When this situation occurs, it will be noted on the specific test method; if the test method is reproduced with minor revision, those paragraphs that are different are identified. To facilitate reference to the tests, to retain consistency of presentation, and to provide for future expansion, each test is identified by a number (assigned sequentially) added to the prefix (group code) letter showing the group to which the test method belongs. The test method numbers have no significance with respect to an eventual test sequence; that responsibility rests with the relevant specification that calls for the method being performed. The relevant specification, in most instances, also describes pass/fail criteria. The third clause deals with the topics accuracy, precision and resolution. Errors and uncertainties are inherent in all measurement processes. The information given enables valid estimates of the amount of error and uncertainty to be taken into account. The test data serve a number of purposes which include monitoring of a process, enhancing of confidence in quality conformance, arbitration between customer and supplier. In any of these circumstances, it is essential that confidence can be placed upon the test data in terms of accuracy (calibration of the test instruments and/or system), precision (the repeatability and uncertainty of the measurement, and resolution (suitability of the instrument and or test system). Clause 4 describes the following test methods: Test 5-3X01 - Flux past viscosity - T-bar spindle method serves for the determination of viscosity of flux pastes. Test 5-3X02 - Spread test on extracted solder flux, paste flux and solder paste provides information on the activity of solder pastes. Test 5-3X03 - Solder paste viscosity - T-bar spindle method is a standard method for the determination of the solder paste viscosity in the range of 300 Pa ⋅ s to 1 600 Pa ⋅ s. Test 5-3X04 - Solder paste viscosity - T bar spindle method is a standard method for the determination of the solder paste viscosity. The method is applicable for viscosities up to Pa ⋅ s. Test 5-3X05 - Solder paste viscosity - Spiral pump method is a standard method for the determination of solder paste viscosity in a range of 300 Pa ⋅ s up to 1 600 300 Pa ⋅ s. Test 5-3X06 - Solder paste viscosity -Spiral pump method is a standard method for the determination of the solder paste viscosity up to 300 Pa ⋅ s. Test 5-3X07 - Solder paste - Spread test determines the vertical and horizontal spread of lot pasts. Test 5-3X08 - Solder paste - Solder ball test is carried out in order to determine the melting characteristics of a solder paste. The ability of the pre-alloyed solder particles in the paste to merge into spheres on a non-wettable substrate under defined test conditions is determined. Test 5-3X09 - Tack test of solder pastes specifies two methods for the determination of the ability of a lot paste print image. The force to hold a probe inserted into the solder paste is measured by measuring the force required to separate the probe from the paste. The time between printing the image and applying the probe is gradually increased to simulate changes in a manufacturing process. Test 5-3X10 - Wetting test for solder pastes serves for the determination of the ability of a solder paste to wet an oxidized copper surface and qualitative examination of the amount of solder paste splashes that occur during through hole reflow soldering. Test 5-3X11 - Determination of the solder powder particle size distribution, screening method for powder types 1 to 4 describes a method for determining whether or not the solder powder in a solder paste corresponds to the required powder type. Test 5-3X12 - Measurement of solder powder particle size distribution - Microscope method is a standard microscopy method for estimation of the particle size and shape of solder powders in solder pastes. Test 5-3X13 - Solder powder particle size distribution - Optical image analyser method is used to determine the particle size distribution in powders for solder pastes by means of image analysis. Test 5-3X14 - Determination of the solder powder particle size distribution - Measuring laser diffraction methods is a test method for determining the particle size distribution in powders for solder pastes by means of laser scanning. Test 5-3X15 - Determination of the maximum solder powder particle size is used to determine the maximum (average) solder particle size in solder pastes using a measuring device to determine the grinding fineness of pastes. Test 5-3X16 - Solder paste metal content by weight is a method by which the percentage metal content of solder pastes is determined. Informative Annex A describes the typical comparison of particle size distributions between the laser diffraction method and the screening method. The responsible committee is DKE/K 682 "Montageverfahren für elektronische Baugruppen" ("Electronics assembly technology") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.

Document: references other documents

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen