NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61189-5-2 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 61189-5 | 2006-08 | Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies More |
| IEC 61189-6 | 2006-07 | Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in electronic assemblies More |
| IEC 61190-1-1 | 2002-03 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly More |
| ISO 9455-10 | 2012-09 | Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method More |
| ISO 9455-2 | 1993-04 | Soft soldering fluxes; test methods; part 2: determination of non-volatile matter, ebulliometric method More |
| ISO 9455-8 | 1991-12 | Soft soldering fluxes; test methods; part 8: determination of zinc content More |
| IEC 60068-1 | 2013-10 | Environmental testing - Part 1: General and guidance More |
| IEC 60068-2-1 | 2007-03 | Environmental testing - Part 2-1: Tests - Test A: Cold More |
| IEC 60068-2-10 | 2005-06 | Environmental testing - Part 2-10: Tests - Test J and guidance: Mould growth More |
| IEC 60068-2-14 | 2009-01 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature More |
