NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61189-5-4 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 61189-5 | 2006-08 | Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies More |
| IEC 61189-6 | 2006-07 | Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in electronic assemblies More |
| IEC 61189-1 | 1997-03 | Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology More |
| IEC 61189-2 | 2006-05 | Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures More |
| IEC 61189-3 | 2007-10 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) More |
| IEC 61190-1-1 | 2002-03 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly More |
| IEC 61190-1-2 | 2014-02 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly More |
| IEC 61249-2-7 | 2002-03 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad; Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad More |
| ISO 9001 | 2015-09 | Quality management systems - Requirements More |
| ISO 9455-2 | 1993-04 | Soft soldering fluxes; test methods; part 2: determination of non-volatile matter, ebulliometric method More |
