DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61189-5-4
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (IEC 61189-5-4:2015); German version EN 61189-5-4:2015
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 5-4: Allgemeine Prüfverfahren für Materialien und Baugruppen - Lotlegierungen und Lotdraht mit und ohne Flussmittel für bestückte Leiterplatten (IEC 61189-5-4:2015); Deutsche Fassung EN 61189-5-4:2015
Overview
This Part 5-4 relates to test methods for materials or component robustness for printed board assemblies, irrespective of their method of manufacture. The standard is divided into separate parts, covering information for the designer and the test methodology engineer or technician. Each part has a specific focus; methods are grouped according to their application and numbered sequentially as they are developed and released. In some instances test methods developed by other TCs (for example, TC 104) have been reproduced from existing IEC standards in order to provide the reader with a comprehensive set of test methods. When this situation occurs, it will be noted on the specific test method, if the test method is reproduced with minor revision, those paragraphs that are different are identified. This part of IEC 61189 contains test methods for evaluating robustness of materials of component for printed board assemblies. The methods are self-contained, with sufficient detail and description so as to achieve uniformity and reproducibility in the procedures and test methodologies. The tests shown in this standard are grouped according to the following principles: P: preparation/conditioning methods D: dimensional test methods C: chemical test methods E: electrical test methods N: environmental test methods X: miscellaneous test methods To facilitate reference to the tests, to retain consistency of presentation, and to provide for future expansion, each test is identified by a number (assigned sequentially) added to the prefix (group code) letter showing the group to which the test method belongs. The third clause deals with the topics accuracy, precision and resolution. Errors and uncertainties are inherent in all measurement processes. The information given enables valid estimates of the amount of error and uncertainty to be taken into account. The test data serve a number of purposes which include monitoring of a process, enhancing of confidence in quality conformance, arbitration between customer and supplier. In any of these circumstances, it is essential that confidence can be placed upon the test data in terms of accuracy (calibration of the test instruments and/or system), precision (the repeatability and uncertainty of the measurement, and resolution (suitability of the instrument and or test system). Clause 4 deals with the determination of the percentage of flux on/in flux-coated solders and/or solders with a flux core. This test corresponds to a method for determining the percentage of flux on flux-coated solders and/or in solders with a flux core. Clause 5 deals with the spread test on extracted cored wires or from preforms. This test method provides information about the activity of fluxes from flux-coated solders or from preforms. Two methods to choose from are provided. The responsible committee is DKE/K 682 "Montageverfahren für elektronische Baugruppen" ("Electronics assembly technology") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.
Document: references other documents
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
