NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

DIN EN 62137-4 [CURRENT] references following documents:

Document number Edition Title
IEC 62137-3 2011-11 Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints More 
IEC 60191-6-2 2001-12 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages More 
IEC 60191-6-5 2001-08 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) More 
IEC 61249-2-7 2002-03 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad; Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad More 
IEC 61249-2-8 2003-02 Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials clad and unclad; Modified brominated epoxide woven fiberglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad More 
IEC 60068-2-2 2007-07 Environmental testing - Part 2-2: Tests - Test B: Dry heat More 
IEC 60068-2-27 2008-02 Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock More 
IEC 60068-2-58 2015-03 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) More 
IEC 60068-2-6 2007-12 Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal) More 
IEC 60749-1 2002-08 Semiconductor devices - Mechanical and climatic test methods - Part 1: General More