DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 60191-4
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013); German version EN 60191-4:2014
Mechanische Normung von Halbleiterbauelementen - Teil 4: Codierungssystem für Gehäuse und Eingruppierung der Gehäuse nach der Gehäuseform für Halbleiterbauelemente (IEC 60191-4:2013); Deutsche Fassung EN 60191-4:2014
Overview
The designations of the shapes of semiconductor device packages used on the market are often shortened versions or manufacturer designations. Generally used in the context of marketing or advertisement is the three-character designation of the base package. This indicates the code for the package shape complemented by the code for the position of the terminals or the code for the form of inflow. For the purpose of open and computer-based design and automated procedures of aquisition, these marketing related designations are not sufficient; in this case, unambiguous and standardized, manufacturer independent designations are required. This document describes a procedure for the designation of packages and the classification of the shapes of semiconductor device packages as well as a systematic method for the generation of universal descriptive designations for semiconductor device packages. The following modifications have been made with respect to DIN EN 60191-4:2003-03: a) editorial corrections in 4.3.4 and Table 2 of the German translation have been made; b) amendments in Table 3 have been made regarding materials of the package body - S (silicon) and T (foil); c) the package specific characteristics have been modified and amended (Table 4) - code "W" for transparent window has been changed to "D" and new code "P" for stackable packages has been added; d) in Table 5, the designation "Gullwing" has been added for code G and the designation for code R has been changed to "Lateral metallization"; e) code for package design FO has been renamed package for fibre-optic cable elements; f) the translation of the explanations of package designs FM, PM, SO, UC and WL in Clause 5 have been editorially revised; g) additional explanatory information on the principle package code including tabulated presentation have been introduced as new Table B.1. The responsible committee is DKE/UK 631.4 "Gehäuse für Halbleiterbauelemente" ("Packages for semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.
