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NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

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Standards [CURRENT]

IEC 62047-22
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates

Title (German)

Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 22: Elektromechanisches Zug-Prüfverfahren für leitfähige Dünnschichten auf flexiblen Substraten

Edition 2014-06

Original language English , French

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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

IEC 62047-22 Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates

IEC 62047-22
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates