NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61190-1-2 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 61189-5-3 | 2015-01 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies More |
| IEC 61190-1-1 | 2002-03 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly More |
| IEC 61189-5 | 2006-08 | Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies More |
| IEC 61189-6 | 2006-07 | Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in electronic assemblies More |
