DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62047-18
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (IEC 62047-18:2013); German version EN 62047-18:2013
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 18: Biegeprüfverfahren für Dünnschichtwerkstoffe (IEC 62047-18:2013); Deutsche Fassung EN 62047-18:2013
Overview
The main structural materials for MEMS, micromachines, etcetera, have special features, such as a few micron meter size, material fabrication by deposition, photolithography, and/or nonmechanical machining test piece. Thin films are used as main structural materials for MEMS and micromachines. This document specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features. The test method is applicable for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 µm and 10 µm. In addition to provisions for the production of micro test pieces and test performance, the document provides informative notes to the contact surface between the micro sample and substrate, and the relationship between force and displacement. The responsible committee is DKE/K 631 "Halbleiterbaulemente" ("Semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.
