DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61189-11
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys (IEC 61189-11:2013); German version EN 61189-11:2013
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 11: Messung der Schmelztemperatur oder Schmelztemperaturbereiche von Lotlegierungen (IEC 61189-11:2013); Deutsche Fassung EN 61189-11:2013
Overview
This part of IEC 61189 describes measurement methods of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components. The melting temperature range of solder alloys is determined by method A (DSC) or method B, cooling curve of molten solder. The calibration of the temperature shall be carried out with pure materials, the purity of which shall be at least 99,99 %. The melting points of two or more pure materials which shall be close to the temperature to be measured shall be determined under the same conditions that apply for the sample; for temperature correction a compensation equation with linear function shall be determined from the determined measurement values and the indicated melting temperatures. The measurement of the DSC curve shall be carried out as follows. The sample is located in the middle of the crucible; subsequently, it is covered with the lid and the lid is fixed. The crucible with the sample in it is inserted into the crucible holder and the crucible with the aluminium powder is inserted into the other crucible holder. The inert gas (N2) or Ar) shall be passed through until measurement has been completed. Measurement of the DSC curve shall be carried out with a heat-up rate of 0,5 °C/min up to a temperature which is approximately higher than the peak of the heat flow. The steps shall be repeated with each new sample with heat-up rates of 1 °C/min, 2 °C/min, 5 °C/min and 10 °C/min. During the measurement of the cooling curve of molten solder, the entire sample shall be melted in the crucible; subsequently the electric oven shall be switched off and the temperature of the cooling sample shall be measured. Typical cooling curves of molten are illustrated. The responsible committee is DKE/K 682 "Montageverfahren für elektronische Baugruppen" ("Electronics assembly technology") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.
Document: references other documents
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
