DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61788-5
; VDE 0390-5:2014-03
Superconductivity - Part 5: Matrix to superconductor volume ratio measurement - Copper to superconductor volume ratio of Cu/Nb-Ti composite superconducting wires (IEC 61788-5:2013); German version EN 61788-5:2013
Supraleitfähigkeit - Teil 5: Messung des Verhältnisses von Matrixvolumen zu Supraleitervolumen - Verhältnis von Kupfervolumen zu Supraleitervolumen von Cu/Nb-Ti Verbundsupraleiterdrähten (IEC 61788-5:2013); Deutsche Fassung EN 61788-5:2013
Overview
This part of IEC 61788 covers a test method for the determination of copper to superconductor volume ratio of Cu/Nb-Ti composite superconducting wires. This test method and the alternate method in Annex A are intended for use with Cu/Nb-Ti composite superconducting wires with a cross-sectional area of 0,1 mm [2] to 3 mm [2], a diameter of the Nb-Ti filament(s) of 2 [µm] to 200 [µm], and a copper to superconductor volume ratio of 0,5 or more. The Cu/Nb-Ti composite test conductor discussed in this method has a monolithic structure with a round or rectangular cross-section. This test method is carried out by dissolving the copper with nitric acid. Deviations from this test method that are allowed for routine tests and other specific restrictions are given in this standard. Cu/Nb-Ti composite superconducting wires beyond the limits in the cross-sectional area, the filament diameter and the copper to superconductor volume ratio could be measured with the present method with an anticipated reduction of uncertainty. Other, more specialized, specimen test geometries may be more appropriate for conductors beyond the limits and have been omitted from this present standard for simplicity and to retain low uncertainty. The test method given in this standard is expected to apply to other superconducting composite wires after some appropriate modifications. The responsible body is DKE/K 184 "Supraleiter" ("Superconductors") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.
