NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61191-1 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 61189-1 | 1997-03 | Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology More |
| IEC 61189-3 | 2007-10 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) More |
| IEC 61190-1-1 | 2002-03 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly More |
| IEC 61249-8-8 | 1997-06 | Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings More |
| IEC 61188-5-1 | 2002-07 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations; Generic requirements More |
| IEC 61188-5-2 | 2003-06 | Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations; Discrete components More |
| IEC 61188-5-3 | 2007-10 | Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides More |
| IEC 61188-5-4 | 2007-10 | Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides More |
| IEC 61188-5-5 | 2007-10 | Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides More |
| IEC 61188-5-6 | 2003-01 | Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations; Chip carriers with J-leads on four sides More |
