2. Getting involved
3. Standards Committees
4. DKE

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

Overview

This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes. This standard recognizes that electrical and electronic assemblies are subject to classifications by intended end-item use. Three general end-product levels have been established to reflect differences in producibility, functional performance requirements, and verification (inspection/test) frequency. It should be recognized that there may be overlaps of equipment between levels. The user of the assemblies is responsible for determining the level to which the product belongs. The contract shall specify the level required and indicate any exceptions or additional requirements to the parameters, where appropriate. - Level A: General electronics products Includes consumer products, some computer and computer peripherals, and hardware suitable for applications where the major requirement is function of the completed assembly. - Level B: Dedicated service electronics products Includes communications equipment, sophisticated business machines, and instruments where high performance and extended life is required, and for which uninterrupted service is desired but not mandatory. Typically, the end-use environment would not cause failures. - Level C: High performance electronics products Includes all equipment where continued performance or performance-on-demand is mandatory. Equipment downtime cannot be tolerated, end-use environment may be uncommonly harsh, and the equipment shall function when required, such as life support systems and other critical systems. This standard requires the use of process control methodologies in the planning implementation and evaluation of the manufacturing processes used to produce soldered electrical and electronic assemblies. The philosophy, implementation strategies, tools and techniques may be applied in different sequences depending on the specific company, operation, or variable under consideration, to relate process control and capability to end-product requirements. The applicable requirements of this standard shall be imposed by each manufacturer or supplier on all applicable subcontracts and purchase orders. The manufacturer or supplier shall not impose or allow any variation from these requirements on subcontracts or purchase orders other than those that have been approved by the user. Unless otherwise specified, the requirements of this standard are not imposed on the procurement of off-the-shelf (catalogue) assemblies or subassemblies. However, the manufacturer of these items may comply as deemed appropriate. Materials used in the soldering processes stipulated in this standard shall be as specified hereinafter. Since the materials and processes specified may be incompatible in some combinations, the manufacturer shall be responsible for selecting the combination of materials and processes that will produce acceptable products. The responsible committee is DKE/K 682 "Montageverfahren für elektronische Baugruppen" ("Electronics assembly technology") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.

Document: references other documents

Document: referenced in other documents

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen