NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61193-3 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 62326-4 ; QC 230500:1996-12 | 1996-12 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification More |
| IEC 61189-2 | 2006-05 | Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures More |
| IEC 61189-3 | 2007-10 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) More |
| IEC 61193-1 | 2001-12 | Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies More |
| IEC 61193-2 | 2007-08 | Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages More |
| IEC 61249-2-34 | 2009-02 | Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials, clad and unclad for high frequency application - Non-halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined permittivity (equal or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad More |
| IEC 62326-1 ; QC 230000:2002-03 | 2002-03 | Printed boards - Part 1: Generic specification More |
| IEC 62326-4-1 ; QC 230401:1996-12 | 1996-12 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C More |
| ISO 11014 | 2009-03 | Safety data sheet for chemical products - Content and order of sections More |
