DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62047-13
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (IEC 62047-13:2012); German version EN 62047-13:2012
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 13: Biege- und Scherprüfverfahren zur Messung der Haftfestigkeit bei MEMS-Strukturen (IEC 62047-13:2012); Deutsche Fassung EN 62047-13:2012
Overview
Micro-sized elements of micro-electromechanical (MEMS) devices are made up of laminated fine pattern films on a substrate, which are fabricated by deposition, plating, and/or coating with photolithography. MEMS devices include a large number of interfaces between dissimilar materials, at which delamination occasionally occurs during fabrication or in operation. Combination of the materials at the junction determines the adhesive strength; moreover, defects and residual stress in the vicinity of the interface, which are changing by processing condition, strongly affect the adhesive strength. This part of DIN EN 62047 specifies the adhesive testing method between micro-sized elements and a substrate using the columnar shape of the specimens. This document can be applied to adhesive strength measurement of microstructures, prepared on a substrate, with width and thickness of 1 µm to 1 mm, respectively. It therefore serves the selection of optimum materials and processing conditions for MEMS device components. This document does not particularly restrict test piece material, test piece size and performance of the measuring device, since the materials and size of MEMS device components range widely and testing machines for micro-sized materials have not been generalized. The responsible committee is K 631 "Halbleiterbauelemente" ("Semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.
