DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62047-14
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials (IEC 62047-14:2012); German version EN 62047-14:2012
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 14: Verfahren zur Ermittlung der Grenzformänderung metallischer Dünnschichtwerkstoffe (IEC 62047-14:2012); Deutsche Fassung EN 62047-14:2012
Overview
If micro-electromechanical devices are manufactured by a forming process such as imprinting, it is necessary to predict the material failure in order to increase the reliability of the components. Through this prediction, the effectiveness of manufacturing MEMS components by a forming process can also be improved, because the period of developing a product can be reduced and manufacturing costs can thus be decreased. This document describes one of the prediction methods for material failure during an imprinting process. Definitions and procedures for measuring the forming limit of metallic film materials with a thickness range from 0,5 µm to 300 µm are defined. The forming limit diagram is determined by submitting the film material to tensile strain with a hemispherical punch. This process is continued until rupture failure of the film material occurs. The metallic film materials described herein are typically used in electric components, MEMS and micro-devices.
