DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61967-8
; VDE 0847-21-8:2012-04
Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method (IEC 61967-8:2011); German version EN 61967-8:2011
Integrierte Schaltungen - Messung von elektromagnetischen Aussendungen - Teil 8: Messung der abgestrahlten Aussendungen - IC-Streifenleiterverfahren (IEC 61967-8:2011); Deutsche Fassung EN 61967-8:2011
Overview
The measurement procedure of this part of the DIN EN 61967 standard series describes a method for measuring the electromagnetic radiated emission from an integrated circuit (IC) using an IC stripline in the frequency range of 150 kHz up to 3 GHz. The integrated circuit to be evaluated is mounted on an EMC test board (PCB) between the active conductor and the ground plane of the IC stripline arrangement. This test method is based on the TEM wave guide measurement principle according to IEC 61000-4-20. The intent of this test method is to provide a quantitative measure of the RF emissions from ICs for comparison or other purposes. A Stripline set-up is used to measure the RF emission of integrated circuits. The IC Stripline is a special kind of transmission line that propagates a TEM wave and offers a broadband method of measuring either immunity of a DUT to fields generated within the IC Stripline or radiated emission from a DUT placed within the IC Stripline. This eliminates the use of conventional antennas with their inherent measurement limitations of bandwidth, non-linear phase, directivity and polarization. This part of DIN EN 61967 is to be read in conjunction with DIN EN 61967-1. Future standards of this series bear the given new general title and are incorporated as measuring instructions for EMC into the corresponding series with VDE classification 0847-21. The titles of the existing standards of this series are updated in the next edition and they will also be incorporated, together with the VDE classification 0847-22, into the VDE body of technical rules. The responsible committee is K 631 "Halbleiterbauelemente" ("Semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.
