2. Getting involved
3. Standards Committees
4. DKE

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

Overview

The DIN EN 60191-6 standard series is based on the corresponding IEC 60191-6 series of International Standards. It defines rules for outline drawings of surface mounted semiconductor device packages of varying package and terminal designs which are used during computer-supported design and manufacturing processes. This part of DIN EN 60191 standard series contains standard outline drawings, dimensions and recommended variations for all fine pitch land grid array (FLGA) packages with terminal pitch of 0,8 mm or less. The standard replaces DIN EN 60191-6-12:2003-01, for which a transitional period until 2014-07-13 applies. The following modifications have been made with respect to DIN EN 60191-6-12:2003-01: a) the scope has been expanded so that the standard includes the square type FLGA. The title of this standard has been changed accordingly: "rectangular type" has been deleted accordingly from the title; b) ball pitch of 0,3 mm has been added; c) datum is changed from the body datum to the ball datum; d) combination lists of D, E, M_D, and M_E have been revised; e) complete revision of the outline drawings and dimensional tables in accordance with the new edition of IEC 60191-6; f) complete editorial revision. The responsible committee is Subcommittee UK 631.4 "Gehäuse für Halbleiterbauelemente" ("Packages for semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.

Document: references other documents

Responsible national committee

DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente