DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 60749-30
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011); German version EN 60749-30:2005 + A1:2011
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 30: Behandlung nicht hermetisch verkappter oberflächenmontierbarer Bauelemente vor Zuverlässigkeitsprüfungen (IEC 60749-30:2005 + A1:2011); Deutsche Fassung EN 60749-30:2005 + A1:2011
Overview
This part of the DIN EN 60749 standard series specifies a standard method which determines the preconditioning of non-hermetic surface mount devices (SMD) prior to reliability testing. This test method specifies the sequence of the preconditioning procedure for non-hermetic surface mount devices so that it is representative for standard industry processing with multiple reflow soldering. Surface mount devices should be subjected to a respective preconditioning sequence in accordance with this standard before they are handed in for specific in-house reliability testing (qualification testing and/or reliability monitor testing) in order to evaluate long-term reliability testing (which is affected by reflow soldering). Amendment A1 to IEC 60749-30:2005 or EN 60749-30:2005 updates the specifications contained regarding the references to IEC 60749-20:2008 (DIN EN 60749-20:2010). These modifications have been incorporated into DIN EN 60749-30 and marked. The responsible committee is K 631 "Halbleiterbauelemente" ("Semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.
