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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

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Standards [CURRENT]

IEC 62047-8
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films

Title (German)

Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 8: Streifen-Biege-Prüfverfahren zur Messung von Zugbeanspruchungsmerkmalen dünner Schichten

Edition 2011-03

Original language English , French

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Table of contents

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Terminology

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

IEC 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films

IEC 62047-8
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films