DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61190-1-3
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007 + A1:2010); German version EN 61190-1-3:2007 + A1:2010
Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-3: Anforderungen an Elektroniklote und an Festformlote mit oder ohne Flussmittel für das Löten von Elektronikprodukten (IEC 61190-1-3:2007 + A1:2010); Deutsche Fassung EN 61190-1-3:2007 + A1:2010
Overview
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for flux-cored and solid solders in the form of rods, bars, sticks, ribbon, solder powder and solder paste, for electronic soldering applications and for special electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. This standard is a quality control document and does not relate directly to the material characteristics in the manufacturing process. Special electronic grade solders include all solders which are not fully covered by the requirements listed in this standard for standard soldered alloys and solder materials. Some examples of special solders are anodes, blocks, moulded parts, rods with hooks and eyes at the ends, multi-component solder powder, and so on. The responsible Committee is K 682 "Montageverfahren für elektronische Baugruppen" ("Electronics assembly technology ") of the DKE (German Commission for Electrical, Electronic and Informational Technologies) at DIN and VDE.
Document: references other documents
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
