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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

About DKE Projects Drafts Publications Documents withdrawn without replacement National committees European committees International committees

Standards [CURRENT]

IEC 60749-19 Edition 1.1
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength test

Title (German)

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 19: Prüfung der Chip-Bondfestigkeit

Edition 2010-11

Original language English , French

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Terminology

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

IEC 60749-19 Edition 1.1 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength test

IEC 60749-19 Edition 1.1
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength test