DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61760-3
Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering (IEC 61760-3:2010); German version EN 61760-3:2010
Oberflächenmontagetechnik - Teil 3: Genormtes Verfahren zur Spezifizierung von Durchsteckmontage-Bauelementen für das Aufschmelzlöten (THR) (IEC 61760-3:2010); Deutsche Fassung EN 61760-3:2010
Overview
This part of IEC 61760 contains a series of requirements, process conditions and corresponding test conditions which shall be applied during the compilation of the specification of electronic components that are intended for usage in through hole reflow (THR) soldering technology. The purpose of this standard is to ensure that components intended for through hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto this standard specifies tests and requirements that need to be part of general, sectional or detail specification, when through hole reflow soldering is intended to be used. Furthermore, this standard provides component users and manufacturers with a reference set of typical process conditions used in through hole soldering technology. The responsible Committee is K 682 "Montageverfahren für elektronische Baugruppen" ("Electronics assembly technology") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.
Document: references other documents
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
