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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

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Standards [CURRENT]

IEC 61191-6
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method

Title (German)

Elektronikaufbauten auf Leiterplatten - Teil 6: Bewertungskriterien für Hohlräume in Lötverbindungen von BGA und LGA und Messmethode

Edition 2010-01

Original language English , French

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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

IEC 61191-6 Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method

IEC 61191-6
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method