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NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

About DKE Projects Drafts Publications Documents withdrawn without replacement National committees European committees International committees

Standards [Withdrawn]

DIN EN 60191-6-13
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) (IEC 60191-6-13:2007); German version EN 60191-6-13:2007

Title (German)

Mechanische Normung von Halbleiterbauelementen - Teil 6-13: Konstruktionsleitfaden für Open-top-Fassungen für Feinraster-Ball-Grid-Array und Feinraster-Land-Grid-Array (FBGA/FLGA) (IEC 60191-6-13:2007); Deutsche Fassung EN 60191-6-13:2007

Document: references other documents

Document: referenced in other documents

Responsible national committee

DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente

Responsible international committee

IEC/SC 47D - Mechanical standardization for semiconductor devices

Edition 2008-04

Original language German

Price from 91.80 €

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Table of contents

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